Difference between revisions of "Cambridge Nanotech S200 ALD"

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! Name || Pulse time [s] || Wait time [s] || Name || Pulse time [s] || Wait time [s]  
 
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| Al<sub>2</sub>O<sub>3</sub> || TMA || 0.015 || 5 || H<sub>2</sub>O || 0.015 || 5 || 245 || 20 || 1 || 06/28/23
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| Al<sub>2</sub>O<sub>3</sub> || TMA || 0.015 || 5 || H<sub>2</sub>O || 0.015 || 5 || 245 || 20 || 1.0 || 11/21/24
 
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| Al<sub>2</sub>O<sub>3</sub> || TMA || 0.015 || 5 || H<sub>2</sub>O || 0.015 || 5 || 200 || 20 || 1 || 09/24/22
 
| Al<sub>2</sub>O<sub>3</sub> || TMA || 0.015 || 5 || H<sub>2</sub>O || 0.015 || 5 || 200 || 20 || 1 || 09/24/22
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* Ozone based depositions
 
* Ozone based depositions
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Recipe name: 200C_SiO2_qnf_wiki
 
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! Name || Pulse time [s] || Wait time [s] : Stop Valve closed / open || Name || Pulse time [s] || Wait time [s] : Stop Valve closed / open  
 
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| SiO<sub>2</sub> || BDEAS || 0.02 || 5 SV closed/ 3 SV open || O<sub>3</sub> || 0.2 || 20 SV closed/ 5 SV open  || 200 || 20 || 0.6 || 02/12/24
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| SiO<sub>2</sub> || BDEAS || 0.05 || 5 SV closed/ 3 SV open || O<sub>3</sub> || 0.2 || 20 SV closed/ 5 SV open  || 200 || 20 || 0.5 || 10/29/24
 
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Latest revision as of 14:56, 21 November 2024


Cambridge Nanotech S200 ALD
ALD-01.jpeg
Tool Name Cambridge Nanotech S200 ALD
Instrument Type Deposition
Staff Manager Sam Azadi
Lab Location Bay 1
Tool Manufacturer Ultratech/Cambridge
Tool Model S200
NEMO Designation ALD-01
Lab Phone 215-898-9736
SOP Link QNF SOP

Description

The QNF Savannah ALD is equipped with high-speed pneumatic pulse valves to enable our unique Exposure Mode™ for thin film deposition on ultra high aspect ratio substrates. This proven precision thin film coating methodology can be used to deposit conformal, uniform films on substrates with aspect ratios of greater than > 2000:1.

The QNF Savannah ALD is capable of holding substrates of different sizes (up to 200mm). The system is equipped with six precursor lines for deposition of Al2O3, HfO2, SiO2, and TiO2.

Applications
Allowed material in ALD System
  • Si, SixNy, SiO2, SOI
  • Hard masks compatible with process temperature

Process Data

Standard Processes

  • Water based depositions
Material Name Precursor 1 Precursor 2 Dep. temperature [C] Carrier flow [sccm] Dep. rate [A/cyc] Date [MM/DD/YY]
Name Pulse time [s] Wait time [s] Name Pulse time [s] Wait time [s]
Al2O3 TMA 0.015 5 H2O 0.015 5 245 20 1.0 11/21/24
Al2O3 TMA 0.015 5 H2O 0.015 5 200 20 1 09/24/22
Al2O3 TMA 0.020 5 H2O 0.020 5 150 20 1 02/09/24
HfO2 TDMAHf 0.15 8 H2O 0.015 5 200 20 1.3 09/24/22
HfO2 TDMAHf 0.3 10 H2O 0.015 8 150 20 1.3 04/25/23
TiO2 TDMATi 0.4 10 H2O 0.015 5 250 20 0.4 05/02/22
TiO2 TDMATi 0.3 10 H2O 0.015 10 150 20 0.5 02/02/24
  • Ozone based depositions

Recipe name: 200C_SiO2_qnf_wiki

Material Name Precursor 1 Precursor 2 Dep. temperature [C] Carrier flow [sccm] Dep. rate [A/cyc] Date [MM/DD/YY]
Name Pulse time [s] Wait time [s] : Stop Valve closed / open Name Pulse time [s] Wait time [s] : Stop Valve closed / open
SiO2 BDEAS 0.05 5 SV closed/ 3 SV open O3 0.2 20 SV closed/ 5 SV open 200 20 0.5 10/29/24

Deposition Rate Monitoring

Hafnia Oct6.jpg
Alumina Oct6.jpg

Resources

SOPs & Troubleshooting


Protocols and Reports
Retrieved from "https://wiki.nano.upenn.edu/wiki/index.php?title=Cambridge_Nanotech_S200_ALD&oldid=2135"