Difference between revisions of "Equipment"
Jump to navigation
Jump to search
| Line 41: | Line 41: | ||
==== Imprint Lithography ==== | ==== Imprint Lithography ==== | ||
* Nanonex NX2600 Nanoimprint | * Nanonex NX2600 Nanoimprint | ||
| + | |||
| + | ==== Resist Coating ==== | ||
| + | * Spinner - Positive Resist (Left) - 4" Wafer Only | ||
| + | * Spinner - Positive Resist (Right) - Small Piece Only | ||
| + | * Spinner - Negative Resist (Left) | ||
| + | * Spinner - Negative Resist (Right) | ||
| + | * Spinner - E-Beam Resist Only | ||
| + | * SUSS MicroTec AS8 AltaSpray | ||
== Soft Lithography == | == Soft Lithography == | ||
| Line 48: | Line 56: | ||
* Silanization Dessicator | * Silanization Dessicator | ||
* Spinner - SU-8/PDMS | * Spinner - SU-8/PDMS | ||
| + | |||
| + | == Metrology == | ||
| + | * KLA Tencor P7 2D profilometer | ||
| + | * KLA Tencor P7 2D&3D/stress profilometer | ||
| + | * Filmetrics F50 (yellow light) | ||
| + | * Filmetrics F40 | ||
| + | * Zygo NewView 7300 Optical Profilometer | ||
| + | * Woollam VAS Ellipsometer | ||
| + | * Jandel Multi Height Four Point Probe | ||
| + | * Micromanipulator 4060 Probe Station | ||
| + | * Filmetrics F50 (white light) | ||
| + | * Zeiss Axio Imager M2m Microscopes | ||
| + | |||
| + | == Backend & Packaging == | ||
| + | * IPG IX-255 Excimer Laser Micromachining | ||
| + | * IPG IX280-DXF Green Laser Micromachining | ||
| + | * EVG 510 Wafer Bonder | ||
| + | * EVG 620 Wafer Bond Aligner | ||
| + | * K&S Wire Bonder | ||
| + | * ADT 7100 Dicing Saw | ||
| + | * Tousimis Critical Point Dryer | ||
| + | * Dimatix ink-Jet Printer | ||
| + | |||
| + | == Thermal Processing == | ||
| + | * MPT Corp. RTP-600S Rapid Thermal Annealer | ||
| + | * MRL Anneal 1 | ||
| + | * MRL Anneal 2 | ||
Revision as of 13:10, 14 March 2022
Deposition
Evaporation
- Lesker Nano-36 Thermal Evaporator
- Lesker PVD75 E-Beam/Thermal Evaporator
- Lesker PVD75 E-beam Evaporator
Sputtering
- Lesker PVD75 DC/RF Sputterer
- Denton Explorer14 Magnetron Sputterer
Chemical Vapor Deposition (CVD)
- Cambridge Nanotech S200 ALD
- Veeco Savannah 200
- Oxford PlasmaLab 100 PECVD
- MRL Wet/Dry Thermal Oxide Furnace
- MRL LPCVD Silicon Nitride Furnace
Etch
Plasma Etch
- Anatech SCE-108 Barrel Asher
- SPTS Si DRIE
- Oxford 80 Plus RIE
- Oxford Cobra ICP Etcher
- Jupiter II RIE Plasma Etcher
Vapor / Wet Etch
- SPTS/Xactix XeF2 Isotropic Etcher
Lithography
E-beam Lithography
- Elionix ELS-7500EX E-Beam Lithography System
- Litho Workstation for BEAMER and TRACER
Laser Lithography
- Heidelberg DWL 66+ Laser Writer
- Nanoscribe Photonic Professional GT
Photolithography
- SUSS MicroTec MA6 Gen3 Mask Aligner
Imprint Lithography
- Nanonex NX2600 Nanoimprint
Resist Coating
- Spinner - Positive Resist (Left) - 4" Wafer Only
- Spinner - Positive Resist (Right) - Small Piece Only
- Spinner - Negative Resist (Left)
- Spinner - Negative Resist (Right)
- Spinner - E-Beam Resist Only
- SUSS MicroTec AS8 AltaSpray
Soft Lithography
- Anatech SCE-106 Barrel Asher
- ABM3000HR Mask Aligner
- SCS PDS2010 Parylene Coater
- Silanization Dessicator
- Spinner - SU-8/PDMS
Metrology
- KLA Tencor P7 2D profilometer
- KLA Tencor P7 2D&3D/stress profilometer
- Filmetrics F50 (yellow light)
- Filmetrics F40
- Zygo NewView 7300 Optical Profilometer
- Woollam VAS Ellipsometer
- Jandel Multi Height Four Point Probe
- Micromanipulator 4060 Probe Station
- Filmetrics F50 (white light)
- Zeiss Axio Imager M2m Microscopes
Backend & Packaging
- IPG IX-255 Excimer Laser Micromachining
- IPG IX280-DXF Green Laser Micromachining
- EVG 510 Wafer Bonder
- EVG 620 Wafer Bond Aligner
- K&S Wire Bonder
- ADT 7100 Dicing Saw
- Tousimis Critical Point Dryer
- Dimatix ink-Jet Printer
Thermal Processing
- MPT Corp. RTP-600S Rapid Thermal Annealer
- MRL Anneal 1
- MRL Anneal 2