Difference between revisions of "Denton Explorer14 Magnetron Sputterer"
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The tool is an open load system in sputter-down configuration with two DC guns and one RF gun and the ability to co-sputter one DC and one RF source. The tool is equipped with a cryo-pump, with automated interface and film thickness control, accepting substrate sizes from pieces through wafers with 150 mm diameters. The tool has platen rotation and cooling. | The tool is an open load system in sputter-down configuration with two DC guns and one RF gun and the ability to co-sputter one DC and one RF source. The tool is equipped with a cryo-pump, with automated interface and film thickness control, accepting substrate sizes from pieces through wafers with 150 mm diameters. The tool has platen rotation and cooling. | ||
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| + | Maximum DC Power is 600 W | ||
| + | Maximum RF Power is 200 W | ||
Revision as of 10:16, 29 March 2022
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| Tool Name | Denton Explorer14 Magnetron Sputterer |
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| Instrument Type | Deposition |
| Staff Manager | Sam Azadi |
| Lab Location | Bay 2 |
| Tool Manufacturer | Denton |
| Tool Model | Explorer14 |
| NEMO Designation | {{{NEMO_Designation}}} |
| Lab Phone | XXXXX |
| SOP Link | SOP |
Description
The Denton Explorer-14 is a magnetron sputter deposition tool for depositing metallic and dielectric films. Sputter deposition is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported to the surface of the substrate, where deposition occurs.
The tool is an open load system in sputter-down configuration with two DC guns and one RF gun and the ability to co-sputter one DC and one RF source. The tool is equipped with a cryo-pump, with automated interface and film thickness control, accepting substrate sizes from pieces through wafers with 150 mm diameters. The tool has platen rotation and cooling.
Maximum DC Power is 600 W Maximum RF Power is 200 W
Deposition Sources
- ITO
- Cr
- Ti
- Ni
- Cu
- Al
- SiO2
- Ge
- Pt
- Au
- Ag
- Pd
- Si
- Al2O3
- Mo
- Te
- V