Difference between revisions of "Tergeo-Plus Plasma Cleaner"
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Latest revision as of 14:35, 2 December 2024
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| Tool Name | Tergeo Plus Plasma Cleaner |
|---|---|
| Instrument Type | Etch |
| Staff Manager | Lucas Barreto |
| Lab Location | Bay 1 |
| Tool Manufacturer | Pie Scietific |
| Tool Model | Tergeo Plus |
| NEMO Designation | DE-09 |
| Lab Phone | {{{Lab_Phone}}} |
| SOP Link | {{{SOP Link}}} |
Description
The PIE Scientific Tergeo-Plus Plasma Cleaner is an RF etcher designed for sample cleaning and ashing of resist with a maximum power of 500 W. It is equipped with three process gasses, O2, Ar, and H2O. It is capable of direct or downstream plasma, pulsed plasma mode, and has in-situ plasma monitoring for precise process control. The tool can hold samples from piece parts to a single 6” wafer. It can also hold a cassette of 25 4” wafers.
Resources
SOP