Difference between revisions of "RTA-01"

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(Created page with "== Description == The Rapid Thermal Annealer-01 anneals the sample up to 1200° C. The processes can be run under atmospheric pressure in Oxygen, Nitrogen, Forming Gas, and A...")
 
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[[Category:Thermal Processing]]
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{{EquipmentInfo
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| name = AET Thermal RX
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| Tool_Name = Rapid Thermal Annealer - 01
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| image = [[Image:CVD-02.jpeg|300px]]
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| imagecaption =
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| Instrument_Type = Deposition
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| Staff_Manager = [[Lucas Barreto | Lucas Barreto]]
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| Lab_Location = Bay 2
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| Tool_Manufacturer = AET
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| Tool_Model = Thermal RX
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| NEMO_Designation = RTA-01
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| Lab_Phone = 215-898-9736
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| SOP Link = [https://repository.upenn.edu/scn_sop/20/ SOP]
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}}
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== Description ==
 
== Description ==
  

Revision as of 13:02, 9 September 2024


AET Thermal RX
CVD-02.jpeg
Tool Name Rapid Thermal Annealer - 01
Instrument Type Deposition
Staff Manager Lucas Barreto
Lab Location Bay 2
Tool Manufacturer AET
Tool Model Thermal RX
NEMO Designation RTA-01
Lab Phone 215-898-9736
SOP Link SOP

Description

The Rapid Thermal Annealer-01 anneals the sample up to 1200° C. The processes can be run under atmospheric pressure in Oxygen, Nitrogen, Forming Gas, and Argon environments. The tool can hold 4’’ wafers or smaller chips. Only MOS-compatible materials are allowed. Compound semiconductors and metals are not allowed.

Resources