View source for 10.1116/6.0004361

=Cryomicroscopy of low melting point metals [[https://pubs.aip.org/avs/jvb/article-pdf/doi/10.1116/6.0004361/20556529/044003_1_6.0004361.pdf]]=
Journal of Vacuum Science &amp; Technology B '''43''', 04403

==Authors==
Michael Colletta (https://orcid.org/0000-0002-2571-8954)

Jamie Ford (https://orcid.org/0000-0002-7657-2465)

Joseph R. Michael (https://orcid.org/0000-0002-3405-2672)

David A. Mueller (https://orcid.org/0000-0003-4129-0473)

Lucille A. Giannuzzi (https://orcid.org/0000-0002-1353-3303)

==Abstract==
The effect of temperature on the sputter yield of indium was predicted based on both previously published and experimentally measured sputter yield data. The increase in the indium sputter yield with temperature can lead to damage when packaged as indium-bump semiconductor structures. Cryogenic (cryo) focused ion beam (FIB) milling, ex situ lift out micromanipulation, and cryogenic scanning transmission electron microscopy (STEM) were used to prepare indium specimens for high-resolution imaging. FIB milling at lower temperatures reduces the sputter yield of indium, preventing heating, damage, and possible void or bubble formation observed in bump structures. In addition, cryo-STEM imaging reduces contamination when imaging In at high resolution. These findings underscore the importance of specimen cooling and cryogenic characterization techniques in preventing thermal sputtering effects and contamination, particularly in low melting point materials, such as indium.


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