View source for Lesker PVD75 DC/RF Sputterer

[[Category:Deposition]]

{{EquipmentInfo
| name = Lesker PVD75 DC/RF Sputterer
| Tool_Name = Lesker PVD75 DC/RF Sputterer
| image = [[Image:PVD-03.jpeg|300px]]
| imagecaption = 
| Instrument_Type = Deposition
| Staff_Manager = David Jones
| Lab_Location = Bay 2
| Tool_Manufacturer = Kurt J. Lesker
| Tool_Model = PVD75
| Iris_Designation = PVD-03
| Lab_Phone = XXXXX
| SOP Link = [https://www.seas.upenn.edu/~nanosop/PVD75_Sputtering_SOP.htm SOP]
}}

== Description ==
The Kurt J. Lesker PVD75 Sputter system is configured with 4 sputter guns in the following configuration:

Target 1: RF power, insulating/conductive target
Target 2: DC power, magnetic/non-magnetic conductive target
Target 3: DC power, non-magnetic conductive target
Target 4: DC power, magnetic/non-magnetic conductive target

The system is cryo-pumped process chamber with automated interface and control of film thickness, wafer platen rotation and heating up to 550°C, accepting sample sized from pieces to 150 mm diameter wafers.


===== Films =====
* ITO
* Cr
* Fe
* Ti
* Ni
* Cu
* Al
* SiO2
* Ge
* Pt
* Ag (Warning! Ag target must be cooled down for more than 15 min after depositing Ag film.)
* Pd
* Si
* Al2O3
* Mo
* Te
* V

== Resources ==

===== SOPs & Troubleshooting =====
* [https://www.seas.upenn.edu/~nanosop/PVD75_Sputtering_SOP.htm QNF SOP]