SUSS MicroTec AS8 AltaSpray

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SUSS MicroTec AS8 AltaSpray
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Tool Name SUSS MicroTec AS8 AltaSpray
Instrument Type Lithography
Staff Manager David Jones
Lab Location Bay 2
Tool Manufacturer SUSS MicroTec
Tool Model AS8 AltaSpray
NEMO Designation {{{NEMO_Designation}}}
Lab Phone XXXXX
SOP Link SOP

Description

SUSS MicroTec’s proprietary AltaSpray coating technology is a unique resist deposition method that is capable of producing highly uniform resist films on different 3-D microstructures. The AltaSpray technology is capable of coating 90° corners, KOH etched cavities, Through Silicon Vias (TSVs) or lenses with topographies ranging from a few micron to 600µm or more. The ability to produce conformal resist coatings on severe topography makes them the ideal choice for R&D, MEMS, 3D-Integration and Wafer Level Packaging applications like 3D image sensor packaging. Wafer sizes from pieces to 200mm.

Applications
  • Automated resist spray coater for high topographies


Resources

Process characterization and tool data


SOPs & Troubleshooting