View source for CEE 200X Spinner

[[Category:Back End]]

{{EquipmentInfo
| name = CEE 200X Spinner
| Tool_Name = CEE 200X Spinner
| image = [[Image:SPN-07.png |300px]]
| imagecaption = 
| Instrument_Type = Back End
| Staff_Manager = [[Ana Cohen | Ana Cohen]]
| Lab_Location = Singh 124
| Tool_Manufacturer = CEE
| Tool_Model = 200X
| NEMO_Designation = SPN-07
| Lab_Phone = 3-9639
| SOP Link = [https://repository.upenn.edu/scn_sop/10/ SOP]
}}

== Description ==
Spinner for coating substrates with resists and protective coverings for laser-cutting and dicing. Can also be used to apply PDMS. Control of ramp rate and speed. Includes wafer centering step.

== Resources ==

===== SOPs & Troubleshooting =====
* SOP: [https://www.seas.upenn.edu/~nanosop/CEE_200X_Spinner_SOP.htm SOP]
* Video for basic tool use (6.47min):[https://www.youtube.com/watch?v=ybFHtd2pPYs Video]