Difference between revisions of "Equipment"
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− | == Physical | + | == Physical Vapor Deposition (PVD) == |
− | + | === Evaporation === | |
− | * PVD-01: [[Lesker Nano-36 Thermal Evaporator | Lesker Nano-36 Thermal Evaporator]] | + | * '''PVD-01:''' [[Lesker Nano-36 Thermal Evaporator | Lesker Nano-36 Thermal Evaporator]] |
− | * PVD-02: [[Lesker PVD75 E-Beam/Thermal Evaporator | Lesker PVD75 E-Beam/Thermal Evaporator]] | + | * '''PVD-02:''' [[Lesker PVD75 E-Beam/Thermal Evaporator | Lesker PVD75 E-Beam/Thermal Evaporator]] |
− | * PVD-04: [[Lesker PVD75 E-beam Evaporator | Lesker PVD75 E-beam Evaporator]] | + | * '''PVD-04:''' [[Lesker PVD75 E-beam Evaporator | Lesker PVD75 E-beam Evaporator]] |
− | + | === Sputtering === | |
− | * PVD-03: [[Lesker PVD75 DC/RF Sputterer | Lesker PVD75 DC/RF Sputterer]] | + | * '''PVD-03:''' [[Lesker PVD75 DC/RF Sputterer | Lesker PVD75 DC/RF Sputterer]] |
− | * PVD-05: [[Denton Explorer14 Magnetron Sputterer | Denton Explorer14 Magnetron Sputterer]] | + | * '''PVD-05:''' [[Denton Explorer14 Magnetron Sputterer | Denton Explorer14 Magnetron Sputterer]] |
− | + | ''PVD-07 is listed under Soft Lithography'' | |
− | * ALD-01: [[Cambridge Nanotech S200 ALD | Cambridge Nanotech S200 ALD]] | + | == Chemical Vapor Deposition (CVD) == |
− | * ALD-03: [[Veeco Savannah 200 | Veeco Savannah 200]] | + | === Atomic layer deposition (ALD) === |
− | * CVD-01: [[Oxford PlasmaLab 100 PECVD | Oxford PlasmaLab 100 PECVD ]] | + | * '''ALD-01:''' [[Cambridge Nanotech S200 ALD | Cambridge Nanotech S200 ALD]] |
− | * CVD-02: [[Sandvik Furnace Stack | Sandvik Furnace Stack - SiO<sub>2</sub>, SiN<sub>x</sub>, Anneal tubes]] | + | * '''ALD-03:''' [[Veeco Savannah 200 | Veeco Savannah 200]] |
+ | |||
+ | === Plasma Enhanced CVD (PECVD) === | ||
+ | * '''CVD-01:''' [[Oxford PlasmaLab 100 PECVD | Oxford PlasmaLab 100 PECVD ]] | ||
+ | |||
+ | === Tube furnace === | ||
+ | * '''CVD-02:''' [[Sandvik Furnace Stack | Sandvik Furnace Stack - SiO<sub>2</sub>, SiN<sub>x</sub>, Anneal tubes]] | ||
== Etching == | == Etching == | ||
− | + | === Plasma Etch === | |
− | * DE-02: [[Anatech SCE-108 Barrel Asher |Anatech SCE-108 Barrel Asher]] | + | * '''DE-02:''' [[Anatech SCE-108 Barrel Asher |Anatech SCE-108 Barrel Asher]] |
− | * DE-03: [[SPTS Si DRIE | SPTS Si DRIE]] | + | * '''DE-03:''' [[SPTS Si DRIE | SPTS Si DRIE]] |
− | * DE-04: [[Oxford 80 Plus RIE | Oxford 80 Plus RIE]] | + | * '''DE-04:''' [[Oxford 80 Plus RIE | Oxford 80 Plus RIE]] |
− | * DE-05: [[Oxford Cobra ICP Etcher | Oxford Cobra ICP Etcher]] | + | * '''DE-05:''' [[Oxford Cobra ICP Etcher | Oxford Cobra ICP Etcher]] |
− | * DE-08: [[Jupiter II RIE Plasma Etcher | Jupiter II RIE Plasma Etcher]] | + | * '''DE-08:''' [[Jupiter II RIE Plasma Etcher | Jupiter II RIE Plasma Etcher]] |
− | + | === Vapor/Wet Etch === | |
− | * DE-06: [[SPTS/Xactix XeF2 Isotropic Etcher | SPTS/Xactix XeF2 Isotropic Etcher]] | + | * '''DE-06:''' [[SPTS/Xactix XeF2 Isotropic Etcher | SPTS/Xactix XeF2 Isotropic Etcher]] |
== Lithography == | == Lithography == | ||
− | + | === E-beam Lithography === | |
− | * EBL-01: [[ Elionix ELS-7500EX E-Beam Lithography System | Elionix ELS-7500EX E-Beam Lithography System ]] | + | * '''EBL-01:''' [[ Elionix ELS-7500EX E-Beam Lithography System | Elionix ELS-7500EX E-Beam Lithography System ]] |
− | * EBL-02: [[Litho Workstation for BEAMER and TRACER | Litho Workstation for BEAMER and TRACER]] | + | * '''EBL-02:''' [[Litho Workstation for BEAMER and TRACER | Litho Workstation for BEAMER and TRACER]] |
+ | |||
+ | === Laser Lithography === | ||
+ | * '''LW-01:''' [[Heidelberg DWL 66+ Laser Writer | Heidelberg DWL 66+ Laser Writer]] | ||
+ | * '''LW-02:''' [[Nanoscribe Photonic Professional GT | Nanoscribe Photonic Professional GT]] | ||
− | === | + | === Photolithography === |
− | * | + | * '''MA-01:''' [[SUSS MicroTec MA6 Gen3 Mask Aligner | SUSS MicroTec MA6 Gen3 Mask Aligner]] |
− | |||
− | === | + | === Imprint Lithography === |
− | * MA- | + | * '''MA-02:''' [[Nanonex NX2600 Nanoimprint | Nanonex NX2600 Nanoimprint]] |
− | === | + | === Resist Coating === |
− | * | + | * '''RC-01:''' [[SUSS MicroTec AS8 AltaSpray | SUSS MicroTec AS8 AltaSpray]] |
+ | * '''SPN-01:''' [[Spinner - Positive Resist (Left) - POLOS | Spinner - Positive Resist (Left) - Polos]] | ||
+ | * '''SPN-03:''' Spinner - Positive Resist (Right) | ||
+ | * '''SPN-04:''' Spinner - Negative Resist (Left) | ||
+ | * '''SPN-05:''' Spinner - Negative Resist (Right) | ||
+ | * '''SPN-06:''' Spinner - E-Beam Resist Only | ||
− | + | ''SPN-07 is listed under Soft Lithography'' | |
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== Soft Lithography == | == Soft Lithography == | ||
− | * [[Anatech SCE-106 Barrel Asher | Anatech SCE-106 Barrel Asher]] | + | * '''SCE-106:''' [[Anatech SCE-106 Barrel Asher | Anatech SCE-106 Barrel Asher]] |
− | * [[ABM3000HR Mask Aligner | ABM3000HR Mask Aligner]] | + | * '''MA-03:''' [[ABM3000HR Mask Aligner | ABM3000HR Mask Aligner]] |
− | * [[SCS PDS2010 Parylene Coater| SCS PDS2010 Parylene Coater]] | + | * '''PVD-07:''' [[SCS PDS2010 Parylene Coater| SCS PDS2010 Parylene Coater]] |
* Silanization Dessicator | * Silanization Dessicator | ||
− | * Spinner - SU-8/PDMS | + | * '''SPN-07:''' [[Spinner - SU-8/PDMS | Spinner - SU-8/PDMS]] |
+ | |||
+ | == Metrology & characterization == | ||
+ | === Stylus profilometers === | ||
+ | * '''MET-01:''' [[KLA Tencor P7 2D profilometer | KLA Tencor P7 2D profilometer]] | ||
+ | * '''MET-02:''' [[KLA Tencor P7 2D&3D/stress profilometer | KLA Tencor P7 2D&3D/stress profilometer]] | ||
+ | |||
+ | === Optical profilometers === | ||
+ | * '''MET-03:''' [[Filmetrics F50 (UV Filter) | Filmetrics F50 (UV Filter)]] | ||
+ | * '''MET-04:''' [[Filmetrics F40 | Filmetrics F40]] | ||
+ | * '''MET-11:''' [[Filmetrics F50 (White Light) | Filmetrics F50 (White Light)]] | ||
+ | * '''MET-05:''' [[Zygo NewView 7300 Optical Profilometer | Zygo NewView 7300 Optical Profilometer]] | ||
+ | |||
+ | === Ellipsometer === | ||
+ | * '''MET-06:''' [[Woollam V-VASE Ellipsometer | Woollam V-VASE Ellipsometer]] | ||
+ | |||
+ | === Electrical characterization === | ||
+ | * '''MET-08:''' [[Jandel Multi Height Four Point Probe | Jandel Multi Height Four Point Probe]] | ||
+ | * '''MET-09:''' Micromanipulator 4060 Probe Station | ||
+ | |||
+ | === Microscopes === | ||
+ | * '''MET-10:''' Zeiss Smartzoom5 2D/3D Optical Microscope | ||
+ | * '''MET-12:''' [[Zeiss Axio Imager M2m Microscopes | Zeiss Axio Imager M2m Microscopes]] (1/4) | ||
+ | * '''MET-13:''' [[Zeiss Axio Imager M2m Microscopes | Zeiss Axio Imager M2m Microscopes]] (2/4) | ||
+ | * '''MET-14:''' [[Zeiss Axio Imager M2m Microscopes | Zeiss Axio Imager M2m Microscopes]] (3/4) | ||
+ | * '''MET-15:''' [[Zeiss Axio Imager M2m Microscopes | Zeiss Axio Imager M2m Microscopes]] (4/4) | ||
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== Backend & Packaging == | == Backend & Packaging == | ||
− | * [[IPG IX-255 Excimer Micromachining Laser | IPG IX-255 Excimer Micromachining Laser]] | + | * '''LMM-01:''' [[IPG IX-255 Excimer Micromachining Laser | IPG IX-255 Excimer Micromachining Laser]] |
− | * [[IPG IX280-DXF Green Micromachining Laser | IPG IX280-DXF Green Micromachining Laser]] | + | * '''LMM-02:''' [[IPG IX280-DXF Green Micromachining Laser | IPG IX280-DXF Green Micromachining Laser]] |
− | * [[EVG 510 Wafer Bonder | EVG 510 Wafer Bonder]] | + | * '''BE-01:''' [[EVG 510 Wafer Bonder | EVG 510 Wafer Bonder]] |
− | * [[EVG 620 Wafer Bond Aligner | EVG 620 Wafer Bond Aligner]] | + | * '''BE-02:''' [[EVG 620 Wafer Bond Aligner | EVG 620 Wafer Bond Aligner]] |
− | * [[K&S Wire Bonder | K&S Wire Bonder]] | + | * '''BE-03:''' [[K&S Wire Bonder | K&S Wire Bonder]] |
− | * [[ADT 7100 Dicing Saw | ADT 7100 Dicing Saw]] | + | * '''BE-04:''' [[ADT 7100 Dicing Saw | ADT 7100 Dicing Saw]] |
− | * [[Tousimis Critical Point Dryer | Tousimis Critical Point Dryer]] | + | * '''BE-06:''' [[TPT HB100 Wire Bonder | TPT HB100 Wire Bonder]] |
− | * Dimatix ink-Jet Printer | + | * '''CPD-01:''' [[Tousimis Critical Point Dryer | Tousimis Critical Point Dryer]] |
+ | * Dimatix ink-Jet Printer | ||
== Thermal Processing == | == Thermal Processing == |
Revision as of 12:53, 8 November 2022
Physical Vapor Deposition (PVD)
Evaporation
- PVD-01: Lesker Nano-36 Thermal Evaporator
- PVD-02: Lesker PVD75 E-Beam/Thermal Evaporator
- PVD-04: Lesker PVD75 E-beam Evaporator
Sputtering
- PVD-03: Lesker PVD75 DC/RF Sputterer
- PVD-05: Denton Explorer14 Magnetron Sputterer
PVD-07 is listed under Soft Lithography
Chemical Vapor Deposition (CVD)
Atomic layer deposition (ALD)
- ALD-01: Cambridge Nanotech S200 ALD
- ALD-03: Veeco Savannah 200
Plasma Enhanced CVD (PECVD)
- CVD-01: Oxford PlasmaLab 100 PECVD
Tube furnace
Etching
Plasma Etch
- DE-02: Anatech SCE-108 Barrel Asher
- DE-03: SPTS Si DRIE
- DE-04: Oxford 80 Plus RIE
- DE-05: Oxford Cobra ICP Etcher
- DE-08: Jupiter II RIE Plasma Etcher
Vapor/Wet Etch
Lithography
E-beam Lithography
- EBL-01: Elionix ELS-7500EX E-Beam Lithography System
- EBL-02: Litho Workstation for BEAMER and TRACER
Laser Lithography
Photolithography
Imprint Lithography
- MA-02: Nanonex NX2600 Nanoimprint
Resist Coating
- RC-01: SUSS MicroTec AS8 AltaSpray
- SPN-01: Spinner - Positive Resist (Left) - Polos
- SPN-03: Spinner - Positive Resist (Right)
- SPN-04: Spinner - Negative Resist (Left)
- SPN-05: Spinner - Negative Resist (Right)
- SPN-06: Spinner - E-Beam Resist Only
SPN-07 is listed under Soft Lithography
Soft Lithography
- SCE-106: Anatech SCE-106 Barrel Asher
- MA-03: ABM3000HR Mask Aligner
- PVD-07: SCS PDS2010 Parylene Coater
- Silanization Dessicator
- SPN-07: Spinner - SU-8/PDMS
Metrology & characterization
Stylus profilometers
- MET-01: KLA Tencor P7 2D profilometer
- MET-02: KLA Tencor P7 2D&3D/stress profilometer
Optical profilometers
- MET-03: Filmetrics F50 (UV Filter)
- MET-04: Filmetrics F40
- MET-11: Filmetrics F50 (White Light)
- MET-05: Zygo NewView 7300 Optical Profilometer
Ellipsometer
- MET-06: Woollam V-VASE Ellipsometer
Electrical characterization
- MET-08: Jandel Multi Height Four Point Probe
- MET-09: Micromanipulator 4060 Probe Station
Microscopes
- MET-10: Zeiss Smartzoom5 2D/3D Optical Microscope
- MET-12: Zeiss Axio Imager M2m Microscopes (1/4)
- MET-13: Zeiss Axio Imager M2m Microscopes (2/4)
- MET-14: Zeiss Axio Imager M2m Microscopes (3/4)
- MET-15: Zeiss Axio Imager M2m Microscopes (4/4)
Backend & Packaging
- LMM-01: IPG IX-255 Excimer Micromachining Laser
- LMM-02: IPG IX280-DXF Green Micromachining Laser
- BE-01: EVG 510 Wafer Bonder
- BE-02: EVG 620 Wafer Bond Aligner
- BE-03: K&S Wire Bonder
- BE-04: ADT 7100 Dicing Saw
- BE-06: TPT HB100 Wire Bonder
- CPD-01: Tousimis Critical Point Dryer
- Dimatix ink-Jet Printer