Difference between revisions of "Equipment"

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* '''BE-03:''' [[K&S Wire Bonder | K&S Wire Bonder]]
 
* '''BE-03:''' [[K&S Wire Bonder | K&S Wire Bonder]]
 
* '''BE-04:''' [[ADT 7100 Dicing Saw | ADT 7100 Dicing Saw]]
 
* '''BE-04:''' [[ADT 7100 Dicing Saw | ADT 7100 Dicing Saw]]
 +
* '''BE-06:'''
 
* '''CPD-01:''' [[Tousimis Critical Point Dryer | Tousimis Critical Point Dryer]]
 
* '''CPD-01:''' [[Tousimis Critical Point Dryer | Tousimis Critical Point Dryer]]
 
* Dimatix ink-Jet Printer
 
* Dimatix ink-Jet Printer

Revision as of 11:47, 21 September 2022

Physical Vapor Deposition (PVD)

Evaporation

Sputtering

PVD-07 is listed under Soft Lithography

Chemical Vapor Deposition (CVD)

Atomic layer deposition (ALD)

Plasma Enhanced CVD (PECVD)

Tube furnace

Etching

Plasma Etch

Vapor/Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • RC-01: SUSS MicroTec AS8 AltaSpray
  • SPN-01: Spinner - Positive Resist (Left) - 4" Wafer Only
  • SPN-03: Spinner - Positive Resist (Right) - Small Piece Only
  • SPN-04: Spinner - Negative Resist (Left)
  • SPN-05: Spinner - Negative Resist (Right)
  • SPN-06: Spinner - E-Beam Resist Only

SPN-07 is listed under Soft Lithography

Soft Lithography

Metrology & characterization

Stylus profilometers

Optical profilometers

Ellipsometer

Electrical characterization

Microscopes

Backend & Packaging

Thermal Processing