Difference between revisions of "Equipment"

From Quattrone Nanofabrication Facility
Jump to navigation Jump to search
Line 63: Line 63:
 
* '''PVD-07:''' [[SCS PDS2010 Parylene Coater| SCS PDS2010 Parylene Coater]]
 
* '''PVD-07:''' [[SCS PDS2010 Parylene Coater| SCS PDS2010 Parylene Coater]]
 
* Silanization Dessicator
 
* Silanization Dessicator
* '''SPN-07:''' Spinner - SU-8/PDMS
+
* '''SPN-07:''' [[Spinner - SU-8/PDMS | Spinner - SU-8/PDMS]]
  
 
== Metrology & characterization ==
 
== Metrology & characterization ==

Revision as of 13:29, 15 August 2022

Physical Vapor Deposition (PVD)

Evaporation

Sputtering

PVD-07 is listed under Soft Lithography

Chemical Vapor Deposition (CVD)

Atomic layer deposition (ALD)

Plasma Enhanced CVD (PECVD)

Tube furnace

Etching

Plasma Etch

Vapor/Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • RC-01: SUSS MicroTec AS8 AltaSpray
  • SPN-01: Spinner - Positive Resist (Left) - 4" Wafer Only
  • SPN-03: Spinner - Positive Resist (Right) - Small Piece Only
  • SPN-04: Spinner - Negative Resist (Left)
  • SPN-05: Spinner - Negative Resist (Right)
  • SPN-06: Spinner - E-Beam Resist Only

SPN-07 is listed under Soft Lithography

Soft Lithography

Metrology & characterization

Stylus profilometers

Optical profilometers

Ellipsometer

Electrical characterization

Microscopes

Backend & Packaging

Thermal Processing