Difference between revisions of "Equipment"

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* PVD-05: [[Denton Explorer14 Magnetron Sputterer | Denton Explorer14 Magnetron Sputterer]]
 
* PVD-05: [[Denton Explorer14 Magnetron Sputterer | Denton Explorer14 Magnetron Sputterer]]
  
== Chemical vapor deposition (CVD) ==
+
== Chemical Vapor Deposition (CVD) ==
  
 
* ALD-01: [[Cambridge Nanotech S200 ALD | Cambridge Nanotech S200 ALD]]
 
* ALD-01: [[Cambridge Nanotech S200 ALD | Cambridge Nanotech S200 ALD]]

Revision as of 13:23, 8 July 2022

Physical Vapor Deposition (PVD)

Evaporation
Sputtering

Chemical Vapor Deposition (CVD)

Etching

Plasma Etch

Vapor / Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • RC-01: SUSS MicroTec AS8 AltaSpray
  • Spinner - Positive Resist (Left) - 4" Wafer Only
  • Spinner - Positive Resist (Right) - Small Piece Only
  • Spinner - Negative Resist (Left)
  • Spinner - Negative Resist (Right)
  • Spinner - E-Beam Resist Only

Soft Lithography

Metrology

Backend & Packaging

Thermal Processing