Difference between revisions of "Equipment"

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* (CVD-02) [[Sandvik Furnace Stack | Sandvik Furnace Stack - SiO<sub>2</sub>, SiN<sub>x</sub>, Anneal tubes]]
 
* (CVD-02) [[Sandvik Furnace Stack | Sandvik Furnace Stack - SiO<sub>2</sub>, SiN<sub>x</sub>, Anneal tubes]]
  
−
== Etch ==
+
== Etching ==
 
===== Plasma Etch =====
 
===== Plasma Etch =====
 
* [[Anatech SCE-108 Barrel Asher |Anatech SCE-108 Barrel Asher]]
 
* [[Anatech SCE-108 Barrel Asher |Anatech SCE-108 Barrel Asher]]

Revision as of 11:56, 8 July 2022

Physical vapor deposition (PVD)

Evaporation
Sputtering

Chemical vapor deposition (CVD)

Etching

Plasma Etch

Vapor / Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • Spinner - Positive Resist (Left) - 4" Wafer Only
  • Spinner - Positive Resist (Right) - Small Piece Only
  • Spinner - Negative Resist (Left)
  • Spinner - Negative Resist (Right)
  • Spinner - E-Beam Resist Only
  • SUSS MicroTec AS8 AltaSpray

Soft Lithography

Metrology

Backend & Packaging

Thermal Processing

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