Difference between revisions of "Equipment"

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* (PVD-05) [[Denton Explorer14 Magnetron Sputterer | Denton Explorer14 Magnetron Sputterer]]  
 
* (PVD-05) [[Denton Explorer14 Magnetron Sputterer | Denton Explorer14 Magnetron Sputterer]]  
  
−
===== Chemical Vapor Deposition (CVD) =====
+
== Chemical vapor deposition (CVD) ==
 +
 
 
* [[Cambridge Nanotech S200 ALD | Cambridge Nanotech S200 ALD]]
 
* [[Cambridge Nanotech S200 ALD | Cambridge Nanotech S200 ALD]]
 
* [[Veeco Savannah 200 | Veeco Savannah 200]]
 
* [[Veeco Savannah 200 | Veeco Savannah 200]]

Revision as of 11:44, 8 July 2022

Physical vapor deposition (PVD)

Evaporation
Sputtering

Chemical vapor deposition (CVD)

Etch

Plasma Etch

Vapor / Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • Spinner - Positive Resist (Left) - 4" Wafer Only
  • Spinner - Positive Resist (Right) - Small Piece Only
  • Spinner - Negative Resist (Left)
  • Spinner - Negative Resist (Right)
  • Spinner - E-Beam Resist Only
  • SUSS MicroTec AS8 AltaSpray

Soft Lithography

Metrology

Backend & Packaging

Thermal Processing

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