Denton Explorer14 Magnetron Sputterer

**Denton Explorer14 Magnetron Sputterer**
Tool Name	Denton Explorer14 Magnetron Sputterer
Instrument Type	Deposition
Staff Manager	Jason (jarohr@seas.upenn.edu)
Lab Location	Bay 2
Tool Manufacturer	Denton
Tool Model	Explorer14
NEMO Designation	{{{NEMO_Designation}}}
Lab Phone	215-898-9748
SOP Link	SOP

Description

Tool overview

The Denton Explorer-14 is a magnetron sputter deposition tool for depositing metallic and dielectric films (such as oxides). Sputter deposition is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported to the surface of the substrate, where deposition occurs. The tool is an open load system in sputter-down configuration with one dedicated DC source and two sources that can use either a DC or RF power supply. Co-deposition from two DC sources or one DC and one RF source is possible, but it is recommended to run co-deposition on PVD-03 as the sources in this tool are not in confocal mode per default. The tool is equipped with a cryo-pump, with an automated interface, accepting substrate sizes from pieces through wafers with 150 mm diameters. The tool has platen rotation and cooling.

Maximum power

Maximum DC Power: 600 W.

Maximum RF Power: 200 W.

You can inflict serious damage to the power supplies if these values are exceeded.

Main differences between PVD-05 (this tool) and PVD-03

There are several differences between our two sputtering tools. Think carefully about what your needs are before deciding what tool to get trained on. If you're ever in doubt, consult with staff.

PVD-05

Large substrate platen that can hold several 4" wafers
Water-cooled platen
Three sputter sources (sputter down)
This tool cannot sputter magnetic materials
Open-load tool; requires at least one hour of pump-down
Co-deposition can be done, but is not recommended (sources not in confocal mode per default)

PVD-03

Small substrate platen that can hold one wafer up to 6"
Four sputter sources (sputter up)
This tool can sputter magnetic materials in source 2 and 4
Load-lock tool; it takes approximately 7 min to load your sample
This is out recommended tool for co-deposition as the sources are always confocal mode

Available materials & process data

All process data were recorded at a base pressure lower than 5 x 10-6 Torr; you can never exceed 200 W on RF and 600 W on DC.

Material Name	Max power	Process data			Recorded
Material Name	Max power	Pressure	Power	Rate	Recorded
Ag (silver)	450 W	3 mTorr	140 W	7.3 Å s^-1
Al (aluminum)	450 W	3 mTorr	200 W	3.0 Å s^-1
Au (gold)	140 W	3 mTorr	140 W	4.6 Å s^-1
Cr (chromium)	450 W	-	-	-
Cu (copper)	450 W	3 mTorr	400 W	3.4 Å s^-1
Ge (germanium)	140 W	-	-	-
ITO (Indium tin oxide)	140 W	-	-	-
Mn (manganese)	140 W	-	-	-
Mo (molybdenum)	450 W	3 mTorr	140	1.9 Å s^-1
Ni (nickel)	350 W	-	-	-
Pd (palladium)	140 W	-	-	-
Pt (platinum)	140 W	3 mTorr	140 W	2.6 Å s^-1
i-Si (intrinsic silicon)	140 W	-	-	-
n-Si (n-type silicon)	280 W	-	-	-
p-Si (p-type silicon)	280 W	-	-	-
Ti (titanium)	350 W	3 mTorr	350 W	2.0 Å s^-1
TiO₂ (titanium dioxide)	140 W	-	-	-
W (tungsten)	450 W	-	-	-
YSZ (yttria-stabilized zirconia)	140 W	-	-	-

Resources

SOPs & Troubleshooting

Target request form

Target Request Form

Master recipes

The listed master recipes are what we used to obtain the process data listed above. We highly recommend our users to use these recipes. However, since they are free to edit, please always double check that the recipe is correct by consulting the charts below.

Note that some recipes have both ramp-up and ramp-down steps. The deposition step can always be found by locating when the shutter is open. The post-deposition cool-down time will vary for different materials depending on their propensity for oxidation. For example, Ag has a long cool-down time of 15 minutes.

All recipes should not be run at base pressures higher than 5e-6 Torr.

Titanium (Ti)

Step T004 is the deposition step and step T005 is the cool-down step (60 s).

Step Number	T000	T001	T002	T003	T004	T005	T006
Step Time (sec)	5	120	60	60	[dep]	60	5
Min Vacuum Setpoint (Torr)

Gas - (PID or Fixed)		PID	PID	PID	PID
Gas - PID Master Gas Select		1	1	1	1
Gas1 - Setpoint (sccm)		10	10	10	10
Gas2 - Setpoint (sccm)

Gas PID Pressure (mTorr)		10	5	3	3
RF Source - Sputter (Watts)
RF Source - Cathode Select
RF Source - Shutter
DC 1 Source - Sputter (Watts)		100	200	300	350
DC 1 Source - Cathode Select		2	2	2	2
DC 1 Source - Shutter					Open
DC 2 Source - Sputter (Watts)

DC 2 Source - Shutter
Pressure Control (Throttle)	Yes	Yes	Yes	Yes	Yes
Ignition Pressure (mTorr)

Rotation Speed (0-100%)	50	50	50	50	50
End Process (Yes)							Yes

Aluminum (Al)

Step T004 is the deposition step and step T005 is the cool-down step (300 s).

Step Number	T000	T001	T002	T003	T004	T005	T006
Step Time (sec)	5	120	60	60	[dep]	300	5
Min Vacuum Setpoint (Torr)

Gas - (PID or Fixed)		PID	PID	PID	PID
Gas - PID Master Gas Select		1	1	1	1
Gas1 - Setpoint (sccm)		10	10	10	10
Gas2 - Setpoint (sccm)

Gas PID Pressure (mTorr)		10	5	3	3
RF Source - Sputter (Watts)
RF Source - Cathode Select
RF Source - Shutter
DC 1 Source - Sputter (Watts)
DC 1 Source - Cathode Select
DC 1 Source - Shutter
DC 2 Source - Sputter (Watts)		100	150	200	200

DC 2 Source - Shutter					Open
Pressure Control (Throttle)		Yes	Yes	Yes	Yes
Ignition Pressure (mTorr)

Rotation Speed (0-100%)		50	50	50	50	50
End Process (Yes)							Yes

Copper (Cu)