Difference between revisions of "Equipment"

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== Physical Vapor Deposition (PVD) ==
+
==Deposition==
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===== Evaporation =====
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=== [[How PVD works|Physical Vapor Deposition (PVD)]] ===
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* PVD-01: [[Lesker Nano-36 Thermal Evaporator | Lesker Nano-36 Thermal Evaporator]]  
+
''[[PVD Equipment Overview|PVD Equipment Overview]]''
−
* PVD-02: [[Lesker PVD75 E-Beam/Thermal Evaporator | Lesker PVD75 E-Beam/Thermal Evaporator]]  
+
==== [[PVD Equipment Overview|Evaporation]] ====
−
* PVD-04: [[Lesker PVD75 E-beam Evaporator | Lesker PVD75 E-beam Evaporator]]
+
* '''PVD-01:''' [[Lesker Nano-36 Thermal Evaporator | Lesker Nano-36 Thermal Evaporator]]  
 +
* '''PVD-02:''' [[Lesker PVD75 E-Beam/Thermal Evaporator | Lesker PVD75 E-Beam/Thermal Evaporator]]  
 +
* '''PVD-04:''' [[Lesker PVD75 E-beam Evaporator | Lesker PVD75 E-beam Evaporator]]
 +
* '''PVD-09:''' [[Intlvac E-beam Evaporator | Intlvac E-beam Evaporator]]
  
−
===== Sputtering =====
+
==== [[PVD Equipment Overview|Sputtering]] ====
−
* PVD-03: [[Lesker PVD75 DC/RF Sputterer | Lesker PVD75 DC/RF Sputterer]]  
+
* '''PVD-03:''' [[Lesker PVD75 DC/RF Sputterer | Lesker PVD75 DC/RF Sputterer]]  
−
* PVD-05: [[Denton Explorer14 Magnetron Sputterer | Denton Explorer14 Magnetron Sputterer]]
+
* '''PVD-05:''' [[Denton Explorer14 Magnetron Sputterer | Denton Explorer14 Magnetron Sputterer]]
  
−
== Chemical Vapor Deposition (CVD) ==
+
'' '''PVD-07''' is listed under Soft Lithography'' <br>
 +
'' '''PVD-08''' is listed under Soft Lithography''
  
−
* ALD-01: [[Cambridge Nanotech S200 ALD | Cambridge Nanotech S200 ALD]]
+
=== [[What is Chemical Vapor Deposition (CVD)?|Chemical Vapor Deposition (CVD)]] ===
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* ALD-03: [[Veeco Savannah 200 | Veeco Savannah 200]]
+
* '''CVD-01:''' [[Oxford PlasmaLab 100 PECVD | Oxford PlasmaLab 100 PECVD ]]
−
* CVD-01: [[Oxford PlasmaLab 100 PECVD | Oxford PlasmaLab 100 PECVD ]]
+
* '''CVD-02 (Tube furnaces):''' [[Sandvik Furnace Stack | Sandvik Furnace Stack - SiO<sub>2</sub>, SiN<sub>x</sub>, Anneal tubes]]
−
* CVD-02: [[Sandvik Furnace Stack | Sandvik Furnace Stack - SiO<sub>2</sub>, SiN<sub>x</sub>, Anneal tubes]]
+
 
 +
=== [[What is Atomic Layer Deposition?|Atomic Layer Deposition (ALD)]] ===
 +
* '''ALD-01:''' [[Cambridge Nanotech S200 ALD | Cambridge Nanotech S200 ALD]]
 +
* '''ALD-02:''' [[Fiji G2 ALD | Fiji G2 ALD]]
 +
* '''ALD-03:''' [[Veeco Savannah 200 | Veeco Savannah 200]]
  
 
== Etching ==
 
== Etching ==
−
===== Plasma Etch =====
 
−
* DE-02: [[Anatech SCE-108 Barrel Asher |Anatech SCE-108 Barrel Asher]]
 
−
* DE-03: [[SPTS Si DRIE | SPTS Si DRIE]] 
 
−
* DE-04: [[Oxford 80 Plus RIE | Oxford 80 Plus RIE]]
 
−
* DE-05: [[Oxford Cobra ICP Etcher | Oxford Cobra ICP Etcher]]
 
−
* DE-08: [[Jupiter II RIE Plasma Etcher | Jupiter II RIE Plasma Etcher]]
 
  
−
==== Vapor / Wet Etch ====
+
''[[How plasma etch works|Plasma Etching Overview]]''
−
* DE-06: [[SPTS/Xactix XeF2 Isotropic Etcher | SPTS/Xactix XeF2 Isotropic Etcher]]
+
 
 +
=== Ion Milling ===
 +
* '''DE-01:''' [[IntlVac NanoQuest 1 IBE |IntlVac NanoQuest 1 IBE]]
 +
 
 +
=== Plasma Etch ===
 +
* '''DE-02:''' [[Anatech SCE-108 Barrel Asher |Anatech SCE-108 Barrel Asher]]
 +
* '''DE-03:''' [[SPTS Si DRIE | SPTS Si DRIE]] 
 +
* '''DE-04:''' [[Oxford 80 Plus RIE | Oxford 80 Plus RIE]]
 +
* '''DE-05:''' [[Oxford Cobra ICP Etcher | Oxford Cobra ICP Etcher]]
 +
* '' '''DE-07''' is listed under Soft Lithography''
 +
* '''DE-08:''' [[Jupiter II RIE Plasma Etcher | Jupiter II RIE Plasma Etcher]]
 +
 
 +
=== Vapor Etch ===
 +
* '''DE-06:''' [[SPTS/Xactix XeF2 Isotropic Etcher | SPTS/Xactix XeF2 Isotropic Etcher]]
  
 
== Lithography ==
 
== Lithography ==
−
==== E-beam Lithography ====
+
=== E-beam Lithography ===
−
* EBL-01: [[ Elionix ELS-7500EX E-Beam Lithography System | Elionix ELS-7500EX E-Beam Lithography System ]]
+
* '''EBL-01:''' [[ Elionix ELS-7500EX E-Beam Lithography System | Elionix ELS-7500EX E-Beam Lithography System ]]
−
* EBL-02: [[Litho Workstation for BEAMER and TRACER | Litho Workstation for BEAMER and TRACER]]
+
* '''EBL-02:''' [[Litho Workstation for BEAMER and TRACER | Litho Workstation for BEAMER and TRACER]]
 +
* '''EBL-03:''' [[ Raith EBPG5200+ E-Beam Lithography System | Raith EBPG5200+ E-Beam Lithography System ]]
 +
 
 +
=== Laser Lithography ===
 +
* '''LW-01:''' [[Heidelberg DWL 66+ Laser Writer | Heidelberg DWL 66+ Laser Writer]]
 +
* '''LW-02:''' [[Nanoscribe Photonic Professional GT | Nanoscribe Photonic Professional GT]]
 +
 
 +
=== Photolithography ===
 +
* '''MA-01:''' [[SUSS MicroTec MA6 Gen3 Mask Aligner | SUSS MicroTec MA6 Gen3 Mask Aligner]]
 +
 
 +
=== Imprint Lithography ===
 +
* '''MA-02:''' [[Nanonex NX2600 Nanoimprint | Nanonex NX2600 Nanoimprint]]
 +
 
 +
=== Resist Coating ===
 +
* '''RC-01:''' [[SUSS MicroTec AS8 AltaSpray | SUSS MicroTec AS8 AltaSpray]]
 +
* '''SPN-01:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - Acetone Soluble Photoresist]]
 +
* '''SPN-03:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - LOR/PMGI]]
 +
* '''SPN-04:''' ReynoldsTech Spinner - Negative Resist
 +
* '''SPN-06:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - E-Beam Resist]]
 +
 
 +
* '' '''SPN-07''' is listed under Back End Processing'' <br>
 +
* '' '''SPN-08''' is listed under Soft Lithography'' <br>
 +
* '' '''SPN-09''' is listed under Soft Lithography''
 +
 
 +
=== Soft Lithography ===
 +
* '''DE-07:''' [[Anatech SCE-106 Barrel Asher | Anatech SCE-106 Barrel Asher]]
 +
* '''MA-03:''' [[ABM3000HR Mask Aligner | ABM3000HR Mask Aligner]]
 +
* '''PVD-07:''' [[SCS PDS2010 Parylene Coater| SCS PDS2010 Parylene Coater]]
 +
* '''PVD-08:''' Silanization Dessicator
 +
* '''SPN-08:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - Negative Epoxy]]
 +
* '''SPN-09:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - PDMS]]
  
−
==== Laser Lithography ====
+
== Metrology & characterization ==
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* LW-01: [[Heidelberg DWL 66+ Laser Writer | Heidelberg DWL 66+ Laser Writer]]
+
=== Stylus profilometers ===
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* LW-02: [[Nanoscribe Photonic Professional GT | Nanoscribe Photonic Professional GT]]
+
* '''MET-01:''' [[KLA Tencor P7 2D profilometer | KLA Tencor P7 2D profilometer]]
 +
* '''MET-02:''' [[KLA Tencor P7 2D&3D/stress profilometer | KLA Tencor P7 2D&3D/stress profilometer]]
  
−
==== Photolithography ====
+
=== Optical profilometers ===
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* MA-01: [[SUSS MicroTec MA6 Gen3 Mask Aligner | SUSS MicroTec MA6 Gen3 Mask Aligner]]
+
* '''MET-05:''' [[Filmetrics Profilm3D | Filmetrics Profilm3D]]
  
−
==== Imprint Lithography ====
+
=== Reflectometers ===
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* MA-02: [[Nanonex NX2600 Nanoimprint | Nanonex NX2600 Nanoimprint]]
+
* '''MET-03:''' [[Filmetrics F50 (UV Filter) | Filmetrics F50 (UV Filter)]]
 +
* '''MET-04:''' [[Filmetrics F40 | Filmetrics F40]]
 +
* '''MET-11:''' [[Filmetrics F50 (White Light) | Filmetrics F50 (White Light)]]
  
−
==== Resist Coating ====
+
=== Ellipsometer ===
−
* RC-01: [[SUSS MicroTec AS8 AltaSpray | SUSS MicroTec AS8 AltaSpray]]
+
* '''MET-06:''' [[Woollam V-VASE Ellipsometer | Woollam V-VASE Ellipsometer]]
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* Spinner - Positive Resist (Left) - 4" Wafer Only
 
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* Spinner - Positive Resist (Right) - Small Piece Only
 
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* Spinner - Negative Resist (Left)
 
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* Spinner - Negative Resist (Right)
 
−
* Spinner - E-Beam Resist Only
 
  
−
== Soft Lithography ==
+
=== Electrical characterization ===
−
* [[Anatech SCE-106 Barrel Asher | Anatech SCE-106 Barrel Asher]]
+
* '''MET-08:''' [[Jandel Multi Height Four Point Probe | Jandel Multi Height Four Point Probe]]
−
* [[ABM3000HR Mask Aligner | ABM3000HR Mask Aligner]]
+
* '''MET-09:''' [[Micromanipulator 4060 Probe Station | Micromanipulator 4060 Probe Station]]
−
* [[SCS PDS2010 Parylene Coater| SCS PDS2010 Parylene Coater]]
+
 
−
* Silanization Dessicator
+
=== Microscopes ===
−
* Spinner - SU-8/PDMS
+
* '''MET-10:''' Zeiss Smartzoom5 2D/3D Optical Microscope
 +
* '''MET-12:''' [[Zeiss Axio Imager M2m Microscopes | Zeiss Axio Imager M2m Microscopes]] (1/4)
 +
* '''MET-13:''' [[Zeiss Axio Imager M2m Microscopes | Zeiss Axio Imager M2m Microscopes]] (2/4)
 +
* '''MET-14:''' [[Zeiss Axio Imager M2m Microscopes | Zeiss Axio Imager M2m Microscopes]] (3/4)
 +
* '''MET-15:''' [[Zeiss Axio Imager M2m Microscopes | Zeiss Axio Imager M2m Microscopes]] (4/4)
  
−
== Metrology ==
 
−
* [[KLA Tencor P7 2D profilometer | KLA Tencor P7 2D profilometer]]
 
−
* [[KLA Tencor P7 2D&3D/stress profilometer | KLA Tencor P7 2D&3D/stress profilometer]]
 
−
* [[Filmetrics F50 (UV Filter) | Filmetrics F50 (UV Filter)]]
 
−
* [[Filmetrics F50 (White Light) | Filmetrics F50 (White Light)]]
 
−
* [[Filmetrics F40 | Filmetrics F40]]
 
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* [[Zygo NewView 7300 Optical Profilometer | Zygo NewView 7300 Optical Profilometer]]
 
−
* [[Woollam V-VASE Ellipsometer | Woollam V-VASE Ellipsometer]]
 
−
* [[Jandel Multi Height Four Point Probe | Jandel Multi Height Four Point Probe]]
 
−
* Micromanipulator 4060 Probe Station
 
−
* [[Zeiss Axio Imager M2m Microscopes | Zeiss Axio Imager M2m Microscopes]]
 
−
 
 
== Backend & Packaging ==
 
== Backend & Packaging ==
−
* [[IPG IX-255 Excimer Micromachining Laser | IPG IX-255 Excimer Micromachining Laser]]
+
* '''LMM-01:''' [[IPG IX-255 Excimer Micromachining Laser | IPG IX-255 Excimer Micromachining Laser]]
−
* [[IPG IX280-DXF Green Micromachining Laser | IPG IX280-DXF Green Micromachining Laser]]
+
* '''LMM-02:''' [[IPG IX280-DXF Green Micromachining Laser | IPG IX280-DXF Green Micromachining Laser]]
−
* [[EVG 510 Wafer Bonder | EVG 510 Wafer Bonder]]
+
* '''BE-01:''' [[EVG 510 Wafer Bonder | EVG 510 Wafer Bonder]]
−
* [[EVG 620 Wafer Bond Aligner | EVG 620 Wafer Bond Aligner]]
+
* '''BE-02:''' [[EVG 620 Wafer Bond Aligner | EVG 620 Wafer Bond Aligner]]
−
* [[K&S Wire Bonder | K&S Wire Bonder]]
+
* '''BE-03:''' [[K&S Wire Bonder | K&S Wire Bonder]]
−
* [[ADT 7100 Dicing Saw | ADT 7100 Dicing Saw]]
+
* '''BE-04:''' [[ADT 7100 Dicing Saw | ADT 7100 Dicing Saw]]
−
* [[Tousimis Critical Point Dryer | Tousimis Critical Point Dryer]]
+
* '''BE-06:''' [[TPT HB100 Wire Bonder | TPT HB100 Wire Bonder]]
−
* Dimatix ink-Jet Printer  
+
* '''SPN-07:''' [[Spinner - SU-8/PDMS | CEE 200X Spinner]]
 +
* Dimatix ink-Jet Printer
  
 
== Thermal Processing ==
 
== Thermal Processing ==
−
* [[MPT Corp. RTP-600S Rapid Thermal Annealer | MPT Corp. RTP-600S Rapid Thermal Annealer]]
+
* '''CVD-02C:''' [[Sandvik Furnace Stack | Sandvik Anneal Furnace 1]]
−
* [[Sandvik Furnace Stack | Sandvik Anneal Furnace 1]]
+
* '''CVD-02D:'''[[Sandvik Furnace Stack | Sandvik Anneal Furnace 2]]
−
* [[Sandvik Furnace Stack | Sandvik Anneal Furnace 2]]
+
* '''RTA-01:'''[[RTA-01 | RTA01]]
 +
* '''RTA-02:'''[[RTA02 | RTA02]]
 +
 
 +
== Wet Processing ==
 +
* '''CPD-01:''' [[Tousimis Critical Point Dryer | Tousimis Critical Point Dryer]]
 +
* '''SRD-01:'''[[RENA Compass Dual Stack Spin Rinse Dryer | RENA Compass Dual Stack Spin Rinse Dryer]]

Latest revision as of 15:43, 4 November 2024

Deposition

Physical Vapor Deposition (PVD)

PVD Equipment Overview

Evaporation

Sputtering

PVD-07 is listed under Soft Lithography
PVD-08 is listed under Soft Lithography

Chemical Vapor Deposition (CVD)

Atomic Layer Deposition (ALD)

Etching

Plasma Etching Overview

Ion Milling

Plasma Etch

Vapor Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • SPN-07 is listed under Back End Processing
  • SPN-08 is listed under Soft Lithography
  • SPN-09 is listed under Soft Lithography

Soft Lithography

Metrology & characterization

Stylus profilometers

Optical profilometers

Reflectometers

Ellipsometer

Electrical characterization

Microscopes

Backend & Packaging

Thermal Processing

Wet Processing

Retrieved from "https://wiki.nano.upenn.edu/wiki/index.php?title=Equipment&oldid=2097"