Difference between revisions of "Equipment"
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| − | == Physical Vapor Deposition (PVD) == | + | ==Deposition== |
| − | === Evaporation === | + | === [[How PVD works|Physical Vapor Deposition (PVD)]] === |
| + | ''[[PVD Equipment Overview|PVD Equipment Overview]]'' | ||
| + | ==== [[PVD Equipment Overview|Evaporation]] ==== | ||
* '''PVD-01:''' [[Lesker Nano-36 Thermal Evaporator | Lesker Nano-36 Thermal Evaporator]] | * '''PVD-01:''' [[Lesker Nano-36 Thermal Evaporator | Lesker Nano-36 Thermal Evaporator]] | ||
* '''PVD-02:''' [[Lesker PVD75 E-Beam/Thermal Evaporator | Lesker PVD75 E-Beam/Thermal Evaporator]] | * '''PVD-02:''' [[Lesker PVD75 E-Beam/Thermal Evaporator | Lesker PVD75 E-Beam/Thermal Evaporator]] | ||
* '''PVD-04:''' [[Lesker PVD75 E-beam Evaporator | Lesker PVD75 E-beam Evaporator]] | * '''PVD-04:''' [[Lesker PVD75 E-beam Evaporator | Lesker PVD75 E-beam Evaporator]] | ||
| + | * '''PVD-09:''' [[Intlvac E-beam Evaporator | Intlvac E-beam Evaporator]] | ||
| − | === Sputtering === | + | ==== [[PVD Equipment Overview|Sputtering]] ==== |
* '''PVD-03:''' [[Lesker PVD75 DC/RF Sputterer | Lesker PVD75 DC/RF Sputterer]] | * '''PVD-03:''' [[Lesker PVD75 DC/RF Sputterer | Lesker PVD75 DC/RF Sputterer]] | ||
* '''PVD-05:''' [[Denton Explorer14 Magnetron Sputterer | Denton Explorer14 Magnetron Sputterer]] | * '''PVD-05:''' [[Denton Explorer14 Magnetron Sputterer | Denton Explorer14 Magnetron Sputterer]] | ||
| − | ''PVD-07 is listed under Soft Lithography'' | + | '' '''PVD-07''' is listed under Soft Lithography'' <br> |
| + | '' '''PVD-08''' is listed under Soft Lithography'' | ||
| − | == Chemical Vapor Deposition (CVD) == | + | === [[What is Chemical Vapor Deposition (CVD)?|Chemical Vapor Deposition (CVD)]] === |
| − | === Atomic | + | * '''CVD-01:''' [[Oxford PlasmaLab 100 PECVD | Oxford PlasmaLab 100 PECVD ]] |
| + | * '''CVD-02 (Tube furnaces):''' [[Sandvik Furnace Stack | Sandvik Furnace Stack - SiO<sub>2</sub>, SiN<sub>x</sub>, Anneal tubes]] | ||
| + | |||
| + | === [[What is Atomic Layer Deposition?|Atomic Layer Deposition (ALD)]] === | ||
* '''ALD-01:''' [[Cambridge Nanotech S200 ALD | Cambridge Nanotech S200 ALD]] | * '''ALD-01:''' [[Cambridge Nanotech S200 ALD | Cambridge Nanotech S200 ALD]] | ||
| + | * '''ALD-02:''' [[Fiji G2 ALD | Fiji G2 ALD]] | ||
* '''ALD-03:''' [[Veeco Savannah 200 | Veeco Savannah 200]] | * '''ALD-03:''' [[Veeco Savannah 200 | Veeco Savannah 200]] | ||
| − | == | + | == Etching == |
| − | + | ||
| + | ''[[How plasma etch works|Plasma Etching Overview]]'' | ||
| − | === | + | === Ion Milling === |
| − | * ''' | + | * '''DE-01:''' [[IntlVac NanoQuest 1 IBE |IntlVac NanoQuest 1 IBE]] |
| − | |||
=== Plasma Etch === | === Plasma Etch === | ||
* '''DE-02:''' [[Anatech SCE-108 Barrel Asher |Anatech SCE-108 Barrel Asher]] | * '''DE-02:''' [[Anatech SCE-108 Barrel Asher |Anatech SCE-108 Barrel Asher]] | ||
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* '''DE-04:''' [[Oxford 80 Plus RIE | Oxford 80 Plus RIE]] | * '''DE-04:''' [[Oxford 80 Plus RIE | Oxford 80 Plus RIE]] | ||
* '''DE-05:''' [[Oxford Cobra ICP Etcher | Oxford Cobra ICP Etcher]] | * '''DE-05:''' [[Oxford Cobra ICP Etcher | Oxford Cobra ICP Etcher]] | ||
| + | * '' '''DE-07''' is listed under Soft Lithography'' | ||
* '''DE-08:''' [[Jupiter II RIE Plasma Etcher | Jupiter II RIE Plasma Etcher]] | * '''DE-08:''' [[Jupiter II RIE Plasma Etcher | Jupiter II RIE Plasma Etcher]] | ||
| − | + | === Vapor Etch === | |
| − | |||
| − | === Vapor | ||
* '''DE-06:''' [[SPTS/Xactix XeF2 Isotropic Etcher | SPTS/Xactix XeF2 Isotropic Etcher]] | * '''DE-06:''' [[SPTS/Xactix XeF2 Isotropic Etcher | SPTS/Xactix XeF2 Isotropic Etcher]] | ||
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=== Resist Coating === | === Resist Coating === | ||
* '''RC-01:''' [[SUSS MicroTec AS8 AltaSpray | SUSS MicroTec AS8 AltaSpray]] | * '''RC-01:''' [[SUSS MicroTec AS8 AltaSpray | SUSS MicroTec AS8 AltaSpray]] | ||
| − | * '''SPN-01:''' Apogee Spinner - | + | * '''SPN-01:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - Acetone Soluble Photoresist]] |
| − | * '''SPN-03:''' Apogee Spinner - | + | * '''SPN-03:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - LOR/PMGI]] |
* '''SPN-04:''' ReynoldsTech Spinner - Negative Resist | * '''SPN-04:''' ReynoldsTech Spinner - Negative Resist | ||
| − | * '''SPN-06:''' Apogee Spinner - E-Beam Resist | + | * '''SPN-06:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - E-Beam Resist]] |
| − | ''SPN-07 is listed under Soft Lithography'' | + | * '' '''SPN-07''' is listed under Back End Processing'' <br> |
| + | * '' '''SPN-08''' is listed under Soft Lithography'' <br> | ||
| + | * '' '''SPN-09''' is listed under Soft Lithography'' | ||
=== Soft Lithography === | === Soft Lithography === | ||
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* '''MA-03:''' [[ABM3000HR Mask Aligner | ABM3000HR Mask Aligner]] | * '''MA-03:''' [[ABM3000HR Mask Aligner | ABM3000HR Mask Aligner]] | ||
* '''PVD-07:''' [[SCS PDS2010 Parylene Coater| SCS PDS2010 Parylene Coater]] | * '''PVD-07:''' [[SCS PDS2010 Parylene Coater| SCS PDS2010 Parylene Coater]] | ||
| − | * Silanization Dessicator | + | * '''PVD-08:''' Silanization Dessicator |
| − | * '''SPN- | + | * '''SPN-08:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - Negative Epoxy]] |
| + | * '''SPN-09:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - PDMS]] | ||
== Metrology & characterization == | == Metrology & characterization == | ||
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=== Electrical characterization === | === Electrical characterization === | ||
* '''MET-08:''' [[Jandel Multi Height Four Point Probe | Jandel Multi Height Four Point Probe]] | * '''MET-08:''' [[Jandel Multi Height Four Point Probe | Jandel Multi Height Four Point Probe]] | ||
| − | * '''MET-09:''' Micromanipulator 4060 Probe Station | + | * '''MET-09:''' [[Micromanipulator 4060 Probe Station | Micromanipulator 4060 Probe Station]] |
=== Microscopes === | === Microscopes === | ||
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* '''BE-04:''' [[ADT 7100 Dicing Saw | ADT 7100 Dicing Saw]] | * '''BE-04:''' [[ADT 7100 Dicing Saw | ADT 7100 Dicing Saw]] | ||
* '''BE-06:''' [[TPT HB100 Wire Bonder | TPT HB100 Wire Bonder]] | * '''BE-06:''' [[TPT HB100 Wire Bonder | TPT HB100 Wire Bonder]] | ||
| + | * '''SPN-07:''' [[Spinner - SU-8/PDMS | CEE 200X Spinner]] | ||
* Dimatix ink-Jet Printer | * Dimatix ink-Jet Printer | ||
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* '''CVD-02C:''' [[Sandvik Furnace Stack | Sandvik Anneal Furnace 1]] | * '''CVD-02C:''' [[Sandvik Furnace Stack | Sandvik Anneal Furnace 1]] | ||
* '''CVD-02D:'''[[Sandvik Furnace Stack | Sandvik Anneal Furnace 2]] | * '''CVD-02D:'''[[Sandvik Furnace Stack | Sandvik Anneal Furnace 2]] | ||
| + | * '''RTA-01:'''[[RTA-01 | RTA01]] | ||
| + | * '''RTA-02:'''[[RTA02 | RTA02]] | ||
== Wet Processing == | == Wet Processing == | ||
* '''CPD-01:''' [[Tousimis Critical Point Dryer | Tousimis Critical Point Dryer]] | * '''CPD-01:''' [[Tousimis Critical Point Dryer | Tousimis Critical Point Dryer]] | ||
* '''SRD-01:'''[[RENA Compass Dual Stack Spin Rinse Dryer | RENA Compass Dual Stack Spin Rinse Dryer]] | * '''SRD-01:'''[[RENA Compass Dual Stack Spin Rinse Dryer | RENA Compass Dual Stack Spin Rinse Dryer]] | ||
Latest revision as of 15:43, 4 November 2024
Deposition
Physical Vapor Deposition (PVD)
Evaporation
- PVD-01: Lesker Nano-36 Thermal Evaporator
- PVD-02: Lesker PVD75 E-Beam/Thermal Evaporator
- PVD-04: Lesker PVD75 E-beam Evaporator
- PVD-09: Intlvac E-beam Evaporator
Sputtering
- PVD-03: Lesker PVD75 DC/RF Sputterer
- PVD-05: Denton Explorer14 Magnetron Sputterer
PVD-07 is listed under Soft Lithography
PVD-08 is listed under Soft Lithography
Chemical Vapor Deposition (CVD)
- CVD-01: Oxford PlasmaLab 100 PECVD
- CVD-02 (Tube furnaces): Sandvik Furnace Stack - SiO2, SiNx, Anneal tubes
Atomic Layer Deposition (ALD)
- ALD-01: Cambridge Nanotech S200 ALD
- ALD-02: Fiji G2 ALD
- ALD-03: Veeco Savannah 200
Etching
Ion Milling
- DE-01: IntlVac NanoQuest 1 IBE
Plasma Etch
- DE-02: Anatech SCE-108 Barrel Asher
- DE-03: SPTS Si DRIE
- DE-04: Oxford 80 Plus RIE
- DE-05: Oxford Cobra ICP Etcher
- DE-07 is listed under Soft Lithography
- DE-08: Jupiter II RIE Plasma Etcher
Vapor Etch
Lithography
E-beam Lithography
- EBL-01: Elionix ELS-7500EX E-Beam Lithography System
- EBL-02: Litho Workstation for BEAMER and TRACER
- EBL-03: Raith EBPG5200+ E-Beam Lithography System
Laser Lithography
Photolithography
Imprint Lithography
- MA-02: Nanonex NX2600 Nanoimprint
Resist Coating
- RC-01: SUSS MicroTec AS8 AltaSpray
- SPN-01: CEE Apogee Spinner - Acetone Soluble Photoresist
- SPN-03: CEE Apogee Spinner - LOR/PMGI
- SPN-04: ReynoldsTech Spinner - Negative Resist
- SPN-06: CEE Apogee Spinner - E-Beam Resist
- SPN-07 is listed under Back End Processing
- SPN-08 is listed under Soft Lithography
- SPN-09 is listed under Soft Lithography
Soft Lithography
- DE-07: Anatech SCE-106 Barrel Asher
- MA-03: ABM3000HR Mask Aligner
- PVD-07: SCS PDS2010 Parylene Coater
- PVD-08: Silanization Dessicator
- SPN-08: CEE Apogee Spinner - Negative Epoxy
- SPN-09: CEE Apogee Spinner - PDMS
Metrology & characterization
Stylus profilometers
- MET-01: KLA Tencor P7 2D profilometer
- MET-02: KLA Tencor P7 2D&3D/stress profilometer
Optical profilometers
- MET-05: Filmetrics Profilm3D
Reflectometers
- MET-03: Filmetrics F50 (UV Filter)
- MET-04: Filmetrics F40
- MET-11: Filmetrics F50 (White Light)
Ellipsometer
- MET-06: Woollam V-VASE Ellipsometer
Electrical characterization
Microscopes
- MET-10: Zeiss Smartzoom5 2D/3D Optical Microscope
- MET-12: Zeiss Axio Imager M2m Microscopes (1/4)
- MET-13: Zeiss Axio Imager M2m Microscopes (2/4)
- MET-14: Zeiss Axio Imager M2m Microscopes (3/4)
- MET-15: Zeiss Axio Imager M2m Microscopes (4/4)
Backend & Packaging
- LMM-01: IPG IX-255 Excimer Micromachining Laser
- LMM-02: IPG IX280-DXF Green Micromachining Laser
- BE-01: EVG 510 Wafer Bonder
- BE-02: EVG 620 Wafer Bond Aligner
- BE-03: K&S Wire Bonder
- BE-04: ADT 7100 Dicing Saw
- BE-06: TPT HB100 Wire Bonder
- SPN-07: CEE 200X Spinner
- Dimatix ink-Jet Printer
Thermal Processing
- CVD-02C: Sandvik Anneal Furnace 1
- CVD-02D: Sandvik Anneal Furnace 2
- RTA-01: RTA01
- RTA-02: RTA02