Difference between revisions of "Oxford Cobra ICP Etcher"
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| imagecaption = | | imagecaption = | ||
| Instrument_Type = Etch | | Instrument_Type = Etch | ||
| − | | Staff_Manager = Sam Azadi | + | | Staff_Manager = [[Sam Azadi | Sam Azadi]] |
| Lab_Location = Bay 2 | | Lab_Location = Bay 2 | ||
| Tool_Manufacturer = Oxford Instruments | | Tool_Manufacturer = Oxford Instruments | ||
| Tool_Model = Cobra PlasmaPro 100 | | Tool_Model = Cobra PlasmaPro 100 | ||
| − | | | + | | NEMO_Designation = DE-05 |
| − | | Lab_Phone = | + | | Lab_Phone = 215-898-9748 |
| SOP Link = [https://repository.upenn.edu/scn_sop/19/ SOP] | | SOP Link = [https://repository.upenn.edu/scn_sop/19/ SOP] | ||
}} | }} | ||
== Description == | == Description == | ||
| − | Oxford PlasmaPro 100 is an inductively coupled plasma (ICP) etcher. The tool uses an RF magnetic field to induce an RF electric field and energize the electrons that result in the ionization of gas molecules and atoms at low pressures. | + | Oxford PlasmaPro 100 is an inductively coupled plasma (ICP) etcher. The tool uses an RF magnetic field to induce an RF electric field and energize the electrons that result in the ionization of gas molecules and atoms at low pressures. |
| + | * Max ICP power: 3 kW | ||
| + | * Max RF power: 200 W | ||
The tool is connected to the following gases: | The tool is connected to the following gases: | ||
| Line 27: | Line 29: | ||
* Etch of SiNx | * Etch of SiNx | ||
* Etch of InP | * Etch of InP | ||
| − | * Etch of Al, Cr, Ti, hafnia, alumina .... | + | * Etch of Al, Cr, Ti, Nb, hafnia, alumina .... |
- for a complete list of materials etched in the tool please refer to the SOP at the bottom off this page | - for a complete list of materials etched in the tool please refer to the SOP at the bottom off this page | ||
| + | |||
| + | NOTE: Au and Ag, Se, and Li compounds are NOT ALLOWED in the system | ||
== Resources == | == Resources == | ||
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===== SOPs & Troubleshooting ===== | ===== SOPs & Troubleshooting ===== | ||
* [https://repository.upenn.edu/scn_sop/19/ QNF SOP] | * [https://repository.upenn.edu/scn_sop/19/ QNF SOP] | ||
| + | * [https://upenn.app.box.com/folder/163249152480 Chuck heating and cool down] | ||
Latest revision as of 13:08, 3 January 2024
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| Tool Name | Oxford Cobra ICP Etcher |
|---|---|
| Instrument Type | Etch |
| Staff Manager | Sam Azadi |
| Lab Location | Bay 2 |
| Tool Manufacturer | Oxford Instruments |
| Tool Model | Cobra PlasmaPro 100 |
| NEMO Designation | DE-05 |
| Lab Phone | 215-898-9748 |
| SOP Link | SOP |
Description
Oxford PlasmaPro 100 is an inductively coupled plasma (ICP) etcher. The tool uses an RF magnetic field to induce an RF electric field and energize the electrons that result in the ionization of gas molecules and atoms at low pressures.
- Max ICP power: 3 kW
- Max RF power: 200 W
The tool is connected to the following gases: BCl3, Cl2, Ar, O2, SF6, CF4, and CHF3.
Applications
- Etch of Si
- Etch of SiO2
- Etch of SiNx
- Etch of InP
- Etch of Al, Cr, Ti, Nb, hafnia, alumina ....
- for a complete list of materials etched in the tool please refer to the SOP at the bottom off this page
NOTE: Au and Ag, Se, and Li compounds are NOT ALLOWED in the system